发明名称 Semi-conductor chips
摘要 A semi-conductor plate is fixed to an extensible foil covered with a tensioned pressure foil, then crushed by pressing it between the foils on to a shaped tool. The edges of the broken segments are separated immediately after breaking by the shape of the tool and/or the expansion of the foils. Spec. the extensible foil consists of soft PVC.
申请公布号 DE1932371(A1) 申请公布日期 1971.01.21
申请号 DE19691932371 申请日期 1969.06.26
申请人 DEUTSCHE ITT INDUSTRIES GMBH 发明人 CALOU,GEORGES
分类号 H01L21/304 主分类号 H01L21/304
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