发明名称 ANSCHLUSSFLAECHEN ZUM ANLOETEN VON HALBLEITERBAUSTEINEN IN FLIP CHIP TECHNIK
摘要 <p>Contact members for soldering components to a circuit means or wiring boards, wherein the components include semiconductors, integrated or hybrid circuits such as flip-chip circuit for assembly by reflow-solder methods. A contact member comprises at least two equal geometric areas interconnected by a narrow bridge. In preferred embodiments the contact members are composed of a base gold layer overcoated with a nickel layer.</p>
申请公布号 DE2044494(B2) 申请公布日期 1972.01.13
申请号 DE19702044494 申请日期 1970.09.08
申请人 发明人
分类号 H01L21/60;H05K1/11;(IPC1-7):05K1/10 主分类号 H01L21/60
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