| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To prevent breakage of wires due to encroachment of corrosive liquid, by forming non-porous almina coating on the surface of a portion of Al wirings, which is not coated by a protective film. |
| 申请公布号 |
JPS51142273(A) |
申请公布日期 |
1976.12.07 |
| 申请号 |
JP19750066184 |
申请日期 |
1975.06.02 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
KIYOUMASU MIKIO;OOTSUKI TEIJIROU |
| 分类号 |
H01L23/52;H01L21/28;H01L21/283;H01L21/31;H01L21/3205 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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