| 摘要 |
PURPOSE:To contrive to perform heat radiation effectively and to miniaturize a multichip LSI package by a method wherein chips are fixed in the first concave parts of a ceramic substrate, bonding pads are arranged in the second concave parts provided on the upper edges of the first concave parts, and a heat sink is provided on the upper face of the substrate. CONSTITUTION:Plural concave parts 9 are provided on the ceramic substrate 1 of a package being formed with wiring patterns, and IC chips 2 are fixed therein interposing die pads 11 between the substrate. The second concave parts 10 are provided in a step type on the upper edges of the concave parts 9, and the bonding pads 12 are arranged thereon to be connected to the chips 2 with lead wires 5. The concave parts thereof are formed with alumina green sheets of three layers, and the heat sink 4 formed in a plane type is fixed being adhered closely on the upper face of the sheet 1-3. Accordingly heat generated in the chips 2 can be radiated effectively to the heat sink through the ceramic layers, and mounting of the IC's in high density and miniaturization of the device can be attained. |
