| 摘要 |
PURPOSE:To mount a semiconductor by one soldering by securing a semiconductor package through an insulating spacer to a heat sink piece and inserting the lead terminal of the package through the piece to the terminal hole of a printed board. CONSTITUTION:A semiconductor 1 is clamped with screws 5', 5'' through an insulating spacer 14 to a heat sink piece 2 which has a spacer 4' with a screw hole, and a lead 9 for a collector is simultaneously secured by the screw 5'. Then, the piece 2 is positioned at the prescribed position on a printed board, and corresponding leads 9, 7, 7' are soldered to the holes for the collector, emitter and base. According to the structure, the soldering can be completed by once, and the mounting on the printed board can be simplified. |
