Micromechanical acceleration sensor unit manufacturing method

摘要

The method involves using a vibratable pendulum with a flexible spring which is mounted on a substrate (CH) via a holder and parallel to the substrate surface. An electrically conducting stop mounted on the substrate next to the pendulum acts as a position sensor. The substrate is first covered with a removable temporary layer (P1) to which an electrically conducting layer (P2) is applied. This is then covered with a photoresistive film (P3), whose thickness determines the thickness of the flexible spring. Photographic negative shapes of the pendulum (Gm1), stop (Gm2) and holder (Gm3) are formed by removing photoresist material up to the electrically conducting layer. The shapes are then filled with metal and the temporary layer removed at least immediately adjacent to the pendulum and stop.