| 发明名称 |
Method of assembling a package of a semiconductor component |
| 摘要 |
The package comprises a ceramic part and a metal part, and the method consists in hot-pressing the ceramic part 4 onto the metal part 1, 6 by way of an aluminium washer 3, 5. Application to the assembling of packages of diodes and thyristors. <IMAGE>
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| 申请公布号 |
FR2556132(A1) |
申请公布日期 |
1985.06.07 |
| 申请号 |
FR19830019206 |
申请日期 |
1983.12.01 |
| 申请人 |
CERAVER |
发明人 |
PHILIPPE DARBON, FERNAND GRIVON, ALAIN WICKER, YVON LAZENNEC, ELISABETH MARTINEZ ET JEAN-JACQUES BANQUET |
| 分类号 |
H01L21/50;H01L23/10;(IPC1-7):H01L23/10 |
主分类号 |
H01L21/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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