| 摘要 |
PURPOSE:To perform bonding at a correct temperature and to obtain an excellent bonded part without insufficient bonding, by dividing a bonding stage into the side of a semiconductor element and the side of lead terminals, and controlling the heating temperature for every divided stage. CONSTITUTION:A bonding stage 17 is divided into a stage 17a on which a semiconductor element 1 is mounted and a stage 17 on which lead terminals 2 are provided. Separate heater blocks 21 and 24 are provided. Therefore, the bonding temperature on the side of the element 1 is set at a temperature lower than the melting point temperature of a mounting material, and the temperature on the side of the terminal 2 can be set at a temperature higher than the side of the terminals 2. Thereafter, a capillary 16 and clampers 13 and 14 are moved together with an X-Y table. An electrode 1a and of the element 1 and the terminal 2 are bonded and wired. In this way, the bonding on the side of the terminals can be performed at the correct temperature without utilizing the melting point temperature of the mounting material of the element. The excellent bonded part without insufficient bonding is obtained. |
