WORKPIECE SUPPORTER AND SEMICONDUCTOR WAFER TESTER

摘要

PURPOSE: To obtain a support device for testing a semiconductor chip by supporting a workpiece and retaining it at a fixed position and heating it to a specific positive or negative temperature via a mere contact. CONSTITUTION: A workpiece is retained at a fixed position on an upper surface 7 of a plate 2 of a support device 1 due to pressure decrease effect and one groove 8 for connecting ducts 9 and 10 that are connected to a gas source is provided. A blocking part assembly 15 is used to adjust heat to a desired positive or negative temperature and is connected to a heat source by a duct 11. An outer-periphery chamber 16 has a duct 17 for making connection to a dry compression air source and an exit passage device 18 that is opened at the level of the plate and is placed in a direction directed toward the center of the plate, a dry gas is directed toward the upper part of the surface of the plate and toward the work piece being supported by the plate, thus preventing condensation and dew formation due to a low temperature.