发明名称 Room temperature curable resin composition
摘要 A room temperature curable resin composition comprising a copolymer of (A) with (B) shown below: (A) An acrylic group-containing silane compound represented by the following Formula (I): <IMAGE> (I) wherein R1 represents a monovalent hydrocarbon group; R2 represents an alkylene group having not less than 2 carbon atoms; R3 and R4 each represent a hydrogen atom or a methyl group; m represents 0, 1 or 2; and n represents an integer of not less than 1. (B) A compound having an unsaturated group copolymerizable with said component (A) acrylic group-containing silane compound. This composition can be cured at an accelerated rate not only at the surface but also at the depths thereof, and may crack with difficulty after cured.
申请公布号 US5017668(A) 申请公布日期 1991.05.21
申请号 US19890353610 申请日期 1989.05.18
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 YOSHIHOKA, HIROSHI;YAMAYA, MASAAKI;YANAGISAWA, HIDEYOSHI
分类号 C08F299/08;C08F30/08;C08F230/08;C08F290/00;C08F299/02;C08G77/42;C08L83/04;C08L83/10;C09D143/04 主分类号 C08F299/08
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