| 摘要 |
PURPOSE:To provide a method for manufacturing a printed wiring board which can extremely reduce generation of pits on plating. achieve an improved yield, and has an improved accuracy. CONSTITUTION:In the title manufacturing method of a printed wiring board according to the pattern plating method using alkali development type dry film resist, a printed wiring board where cured resist is formed is treated in water-based liquid solution with a pH which is at least equal to or more than 5 and is equal to or less than 10 before performing acid pretreatment of electrolytic copper plating. |
