| 摘要 |
PURPOSE:To provide a method for manufacturing a printed circuit board in which the board of high quality can be manufactured in a mass production with high yield without the necessity of a complicated step and a special facility. CONSTITUTION:A method for manufacturing a printed circuit board comprises the steps of laminating and integrating a hard printed circuit board 5 having separating grooves or slits 6a partly selectively cut and separated at predetermined positions through an adhesive layer on a main surface of a flexible board 4, and exposing 4a the board 4 for connecting the hard printed circuit boards (units) 5a, 5b to be partly removed selectively at the groove or the slit 6a and cut and separated ion a band state. The groove or the slit 6a corresponding to a region 4a to be exposed in the band state at the board 4 selectively protrude from the cut and separated surface of the board 5, covered with part to be exposed to be peeled and removed. |
