MULTILAYERED WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a high-density and high-reliability multilayered wiring board manufacturing method whereby the prepared hole forming step is omitted and poor conduction and poor insulation caused by cutting pieces of an iorg. filler contained in a base to be an insulation layer will not occur. SOLUTION: A Cu foil 3 is hot press-formed so that an insulation layer 5 exists between a core board 1 having a conductor circuit 10 and fail 3 to form a multilayered structure, vias 4 for wiring between the conductor circuit 10 and foil 3 are formed by a laser beam machine to form a multilayered wiring board. The hot press-forming is made with an insulation layer resin 8 inserted between the board 1 and foil 3.