MULTILAYERED PRINTED WIRING BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method, making it possible to obtain a multilayer printed wiring board good in moisture absorption and heat resistance, employing a build up system. SOLUTION: A resin 2a contg. both a UV-setting and thermosetting components is fed in through-holes 3 of an inner layer circuit board 1 and set to a thermosetting deg. of 0-80% as measured by a differential scanning calorimeter(DSC) and thermosetting resin is applied to a circuit face 8 including the holes 3 on this board 1 in the build up system to form an insulation resin layer 7 covering this face 8. When setting the resin layer 4, the resin is perfectly set, resulting in enhancement of the adhesion of a hole-filling resin layer 2 to the resin layer 4.