| 摘要 |
<p>A chemical mechanical polishing slurry precursor composition comprising urea and at least one second oxidizer. The composition also optionally includes an organic acid, and an abrasive. Also disclosed is a polishing slurry which comprises at least two oxidizers, an organic acid and an abrasive, as well as a polishing slurry which comprises urea hydrogen peroxide, a second oxidizer, and an abrasive. Further disclosed are methods for preparing a polishing slurry from the precursor as well as methods for using the compositions described herein to remove titanium, titanium nitride, and an aluminum alloy containing layer from a substrate.</p> |
