发明名称 THERMAL CONDUCTIVITY INTERFACE FOR ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide interface, which has excellent mechanical, electrical, thermal, and chemical characteristics, and can be assembled in low pressure flow by constructing a laminated sheet having specified outer layers arranged on both sides of a specified base. SOLUTION: Thermal conductivity interface having mechanical adaptability is composed of a laminated sheet having outer layers arranged on both sides of a base, which is selected from a layer group comprising glass fiber, aluminum foil, expanded metal, polyimide, or polyester. The outer layers have construction represented by a formula (R1 is selected from a group composed of a hydrogen, hydroxyl, or methyl group, and x is an integer having 1-1,000 value), and are composed of organosiloxane having approximately 10-10,000 centipoise viscosity, and poly-dimethyl siloxane having, for example, a hydrogenated end. And they are constructed of reactive product composed of a mixture with a dihydryl aliphatic chain extender having approximately 10-10,000 centipoise viscosity. The reactive product is filled with fine particle solid of approximately 10-60% amount in volume, and the rest is the reactive product.</p>
申请公布号 JPH1142730(A) 申请公布日期 1999.02.16
申请号 JP19970189542 申请日期 1997.07.15
申请人 BERGQUIST CO:THE 发明人 STEVEN E BURGERSON
分类号 B32B7/02;B32B17/10;B32B27/00;C08G77/04;C08G77/44;G06F1/20;H01L23/36;(IPC1-7):B32B7/02 主分类号 B32B7/02
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