发明名称 ELECTRONIC CIRCUIT BOARD AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To ensure reliable connection of conductors between upper and lower sheets in a multilayer electric circuit board which is produced by stacking insulator sheets on which conductor layers are formed and bonding the upper and lower layers. SOLUTION: An electric circuit board has a plurality of stacked insulator films 11, conductor patterns 15, 13 provided on the insulator films 11, and an adhesive layer 12 for bonding the insulator films 11. An alloy layer 27 is formed at the upper and lower junctions of the conductor pattern 15 in a step of heating and pressing the insulator films.
申请公布号 JPH11204943(A) 申请公布日期 1999.07.30
申请号 JP19980002396 申请日期 1998.01.08
申请人 HITACHI LTD;HITACHI CABLE LTD 发明人 TENMYO HIROYUKI;ISHINO MASAKAZU;AMAMIYA KYOKO;ONDA MAMORU;SATO TAKASHI;MURAKAMI TOMIO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址