| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive and highly reliable IC package fitted to IC for RF and microwave signal. SOLUTION: After on IC die 12 has been jointed to a substrate 15 by a flip-chip method, the blocking sealing material 13 of high viscosity is applied around the outer edge of the IC die. A cavity 16 is formed between the die and the substrate 15. An IC cavity package provided with a short signal route and the inner cavity is formed easily. |
