| 摘要 |
PROBLEM TO BE SOLVED: To enable connection of a wiring board without the provision of soft material for lands of the board at mounting a flip chip and moreover with a fine pitch. SOLUTION: A semiconductor chip 1 having bumps 3 formed on pads 2 of the chip is mounted facedown on a wiring board 5 having lands 4. The lands 4 have a sectional shape which tapere toward its top side and are made of a material that is harder than the material of the bumps 3. When the tops of the lands 4 are embedded into the bumps 3 to electrically connect the lands 4 and bumps 3, the need for providing a soft material for the lands 4 can be eliminated, and connecting with fine pitches becomes possible. |
