ONE SIDE MOLDING THIN SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package of one side molded thin film type is provided to enlarge a mounting density of a main board by forming a bump on a bottom face of a lead and using a solder ball on a bottom face of the bump as an input/output portion. CONSTITUTION: A multitude of input/output pad(210) is formed on a semiconductor chip(200). The semiconductor chip(200) is mounted on a semiconductor chip loading plate(100) by inserting an adhering layer. A multitude of lead(120) is arranged on an outer circumference of the semiconductor chip loading plate(100). A conductive wire(230) connects the input/output pad(210) of the semiconductor chip(200) with the leads(120). A resin sealing portion(300) is used for sealing up the semiconductor chip(200), the semiconductor chip loading plate(100), the conductive wire(230), and the leads(120). A solder ball(240) is formed on bottom faces of bumps(140) of each lead(120).