| 摘要 |
PROBLEM TO BE SOLVED: To enhance adhesion and shorten heating time. SOLUTION: This manufacturing method contains a process for cleaning a transparent insulating substrate 1 on which a transparent electrode circuit is formed by irradiating ultraviolet rays; a process for masking part of the transparent insulating substrate with a protecting mask and treating with a silane coupling agent; a process for removing the protecting mask, heating and drying, then forming an organic thin film EL device; a process for masking part of a sealing cap 7 with a protecting mask same as or having the same shape as the above protecting mask and treating with the silane coupling agent; and a process for removing the protecting mask, heating and drying, then applying an ultraviolet ray curing adhesive 8, and the sealing cap 7 and the transparent insulating substrate 1 are stuck, ultraviolet rays are irradiated to cure the ultraviolet ray curing adhesive 8, and thereby, the transparent insulating substrate 1 and the sealing cap 7 are bonded. |
