MIRROR POLISHING APPARATUS FOR WAFER

摘要

PURPOSE:To eliminate abnormality in the quality of a wafer while enhancing the work efficiency by making uniform the surface of a polishing cloth in line. CONSTITUTION:The mirror polishing apparatus for wafer comprises a block 4 for holding a wafer 5, a plate 9 disposed on the wafer 5 holding side of the block 4, and a viscoelastic polishing cloth 6 fixed to the plate 9, wherein the wafer 5 is pressed against the polishing cloth 6 and slide relatively thereto thus mirror polishing the wafer 5. The mirror polishing apparatus also comprises a member 22 being pressed against the polishing cloth 6, and a seasoning means 20 for making uniform the viscoelastic effect of the polishing cloth 6 over the entire surface thereof.