| 摘要 |
PROBLEM TO BE SOLVED: To detect inconvenience that long condition reliability and long insulation reliability are predicted in a printed wiring board which is die-punched. SOLUTION: Conductor patterns for test 11a to 11h, which are used for the reliability test of the printed wiring board 10, are formed near the die punching work parts 13a and 13b in the printed wiring board 10. A prescribed environment condition is given to the printed wiring board 10, voltage is applied to the conductor patterns for test 11a and 11h and long connection reliability and long insulation reliability are evaluated.
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