发明名称 |
Method of manufacturing electrode substrate |
摘要 |
An electrode substrate comprises a backing substrate carrying thereon a metal electrode layer and/or a recording layer, the layer or layers having a smooth surface area with a surface roughness of less than 1 nm by more than 1 mum2. The smooth surface of the metal electrode layer and/or the recording layer is formed by firstly forming the layer on another substrate having a corresponding smooth surface and then peeling the another substrate off the layer after the layer is bonded to the surface of the backing substrate, whereby the smooth surface profile of the another substrate is transferred to the surface of the layer formed on the backing substrate.
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申请公布号 |
US6475321(B1) |
申请公布日期 |
2002.11.05 |
申请号 |
US20000625550 |
申请日期 |
2000.07.25 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
IKEDA TSUTOMU;KAWASAKI TAKEHIKO |
分类号 |
C25D7/00;G11B9/00;G11B9/12;G11B9/14;(IPC1-7):B32B31/20;H01L23/58;G11B3/70 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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