| 摘要 |
A method and apparatus for achieving a level exposed surface of an adhesive material pool for applying the adhesive material to lead fingers of a lead frame by contacting the lead fingers with the adhesive material pool within an adhesive reservoir. The level adhesive material exposed surface is achieved by attaching a coating stencil having small apertures, such as a screen or a plate with slots, to the adhesive reservoir, such that the only upward outlet for the adhesive material is through the apertures in the coating stencil. The surface tension between walls of the small apertures and the adhesive material flattens out the exposed surface of the adhesive material. This allows a larger area to be printed with a more uniform thickness layer.
|
