| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrain the deformation of a circuit substrate at an electronic part mounting time. <P>SOLUTION: In a chamber of an electronic part packaging apparatus, a substrate holder 12, a substrate supporter 17 which supports a circuit substrate 91 held at the substrate holder 12, and a head which pushes the electronic part 92 to the circuit substrate 91 and mounts it are provided. The substrate supporter 17 has a plurality of support pins 171, a support pin lifting mechanism 172 which rises and falls individually each of the plurality of the support pins 171, a piezoelectric element 173 which detects a load applied to each support pin 171, and a locking mechanism 174 which fixes the plurality of the support pins 171 simultaneously. In the substrate supporter 17, the plurality of the support pins 171 are fixed in a state that tips of the plurality of the support pins 171 are made to abut by equal loads along the shape of the rear surface 911, and the deformation of the circuit substrate 91 at the electronic part 92 mounting time is restrained. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
