发明名称 Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method
摘要 The polishing body is attached to a substrates. The polishing body has a structure in which a polishing pad, a hard elastic member and a soft members are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufactured by Rodel, Inc. is used as the polishing pad. For example, a stainless steel plate is used as the hard elastic member. A Suba400 (commercial name) manufactured by Rodel, Inc. is used as the soft members. The polishing pad 6 has grooves in the polishing surface side. The residual thickness d of the areas of the grooves in the polishing pad is set so as to satisfy the condition 0 mm<d<=0.6 mm. As a result, the ability to eliminate steps can be increased, thus allowing the "local pattern flatness" to be improved, while ensuring the "global removal uniformity"; furthermore, a polishing body with a long useful life can be obtained.
申请公布号 US7189155(B2) 申请公布日期 2007.03.13
申请号 US20040002655 申请日期 2004.12.03
申请人 NIKON CORPORATION 发明人 HOSHINO SUSUMU;SUGAYA ISAO
分类号 B24B1/00;B24B37/00;B24B37/04;B24B37/20;B24B37/22;B24B37/26;B24D13/14;H01L21/304 主分类号 B24B1/00
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