| 摘要 |
A base (3) made of a resin is formed on a printed wiring board (1). An adhesive (4) is applied on the base (3), and an IC chip (5) is placed and fixed thereon. Then, the IC chip (5) is encapsulated with a BGA type package resin (7). The base (3) and the package resin (7) are composed of the same resin.
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