| 发明名称 |
FLIP-CHIP MOUNTED OPTO-ELECTRONIC CIRCUIT |
| 摘要 |
A thermo-optic switch comprises two planar waveguide and a heating element couple to at least one of the planar waveguides. The heating element is coupled to a package substrate using solder bumps.
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| 申请公布号 |
CA2470991(C) |
申请公布日期 |
2008.04.15 |
| 申请号 |
CA20022470991 |
申请日期 |
2002.12.05 |
| 申请人 |
INTEL CORPORATION |
发明人 |
SU, JUN |
| 分类号 |
G02F1/01;G02B6/42;G02F1/313;H05K1/02 |
主分类号 |
G02F1/01 |
| 代理机构 |
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代理人 |
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