发明名称 High-power LGA socket
摘要 A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.
申请公布号 US7402182(B2) 申请公布日期 2008.07.22
申请号 US20050085289 申请日期 2005.03.21
申请人 INTEL CORPORATION 发明人 TRAN DONALD T.
分类号 H01L21/00;H01L23/498;H01L23/50 主分类号 H01L21/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利