发明名称 Method and system for reference-based overlay measurement
摘要 The present invention may include acquiring a plurality of reference measurement images from a plurality of reference overlay target sites of a wafer via a reference image sampling process, wherein the reference image sampling process includes acquiring one or more images at each of a plurality of reference overlay target sites of the at least one wafer, generating a reference image by combining the plurality of reference measurement images acquired from the plurality of reference overlay target sites of the wafer of the reference image sampling process; acquiring one or more measurement images from an overlay target site of the wafer via a measurement image sampling process and measuring a virtual overlay of the one or more measurement images by comparing the one or more measurement images acquired from the overlay target site of the wafer to the generated reference image.
申请公布号 US9390492(B2) 申请公布日期 2016.07.12
申请号 US201313803621 申请日期 2013.03.14
申请人 KLA-Tencor Corporation 发明人 Rotem Efrat
分类号 G06T7/00;G03F7/20 主分类号 G06T7/00
代理机构 Suiter Swantz pc llo 代理人 Suiter Swantz pc llo
主权项 1. A method for performing reference-based overlay metrology using a virtual measurement image, comprising: acquiring a plurality of reference measurement images from a plurality of reference overlay target sites of a wafer via a reference image sampling process, wherein the reference image sampling process includes acquiring one or more images at each of the plurality of reference overlay target sites of the wafer; generating an aggregated overlay target reference image by combining the plurality of reference measurement images acquired from the plurality of reference overlay target sites of the wafer of the reference image sampling process; acquiring one or more measurement images from an overlay target site of the wafer via a measurement image sampling process; and measuring a virtual overlay of the one or more measurement images by comparing the one or more measurement images acquired from the overlay target site of the wafer to the generated aggregated overlay target reference image.
地址 Milpitas CA US