| 发明名称 | LED module | ||
| 摘要 | In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof. | ||
| 申请公布号 | US9414447(B2) | 申请公布日期 | 2016.08.09 |
| 申请号 | US201314133747 | 申请日期 | 2013.12.19 |
| 申请人 | OSRAM GmbH | 发明人 | Ghasemi Afshar Farhang;Bergenek Krister;Dobner Andreas;Huebner Holger;Weckbecker Meik;Wirth Ralph |
| 分类号 | H01L33/52;H01L33/44;H01L23/522;F21V33/00;H05B33/08 | 主分类号 | H01L33/52 |
| 代理机构 | Viering, Jentschura & Partner mbB | 代理人 | Viering, Jentschura & Partner mbB |
| 主权项 | 1. A light emitting diode module, comprising: a carrier plate; at least one light emitting diode; and at least one sensor configured to register light emitted by the light emitting diode, wherein the light emitting diode is attached to a light emitting diode installation side of the carrier plate, wherein the carrier plate includes a through hole, the through hole comprising a bore having a first diameter in a first portion thereof, and a second diameter larger than said first diameter in a second portion thereof, the second portion defining a recess in said carrier plate co-axial with said first portion, wherein the sensor is installed countersunk within the recess. | ||
| 地址 | Munich DE | ||