| 主权项 |
1. An apparatus comprising:
an integrated circuit (IC) package comprising:
an IC die disposed at a first surface of a substrate, the IC die comprising radio frequency (RF) circuitry; andthe substrate, wherein the substrate comprises:
a signal via extending between first and second metal layers of the substrate;the first metal layer proximate to the first surface and comprising a first coplanar waveguide, the first coplanar waveguide having a first signal line coupling a bump of the IC die to the signal via and having a first ground plane co-planar with the first signal line;the second metal layer proximate to a second surface of the substrate and comprising a second coplanar waveguide, the second coplanar waveguide having a second signal line coupling the signal via to a launcher element and having a second ground plane co-planar with the second signal line;a waveguide channel aperture comprising a first region surrounding the launcher element, the first region substantially devoid of conductive material;a via fence comprising metal vias disposed at a perimeter of the first region and extending between the first ground plane and the second ground plane;a third metal layer disposed between the first metal layer and the second metal layer, the third metal layer comprising a second waveguide channel aperture comprising a second region aligned with the first region, the second region being substantially devoid of conductive material; andwherein the third metal layer implements signal line routing for circuit components of the IC package. |
