Package structures including discrete antennas assembled on a device

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

主权项

1. A package structure comprising:
a discrete antenna disposed on a back side of a first device, wherein the discrete antenna comprises an antenna substrate, wherein the antenna substrate comprises alternating layers of conductive material and dielectric material; a through antenna substrate via, wherein the through antenna substrate via is vertically disposed through the antenna substrate; a through substrate via that is vertically disposed within the first device and coupled with the through antenna substrate via; a package substrate coupled with an active side of the first device; and a radiating element perpendicularly coupled with the through antenna substrate via and disposed on a top portion of the discrete antenna, wherein the radiating element comprises alternating layers of conductive material and dielectric material.