| 摘要 |
PURPOSE:To completely remove a binder at a low temp. by adding a binder resin to a ceramic powder material to produce a green sheet, keeping the green sheet for specified time at a specified temp. in a nonoxidizing atmosphere, and then sintering the sheet. CONSTITUTION:A binder resin (e.g. a soln. obtd. by dissolving ethyl methacrylate polymer in methyl ethyl ketone) is added to a ceramic powder material to produce a green sheet. Then the green sheet is maintained for specified time in a nonoxidizing atmosphere at <=600 deg.C which is the depolymn. temp. of the binder to decompose the binder into monomers by depolymn. reaction so that the binder is removed by scattering the monomers. Then the temp. is raised to the firing temp. of the ceramic to sinter the sheet. By this method, the binder can be completely removed at a rather low temp. in the removing process of the binder. Therefore, low temp. firing can be done which enables use of a low resistance metal having the low melting point. Thus, a ceramic multilayer circuit board having the low dielectric const. is produced. |
