| 摘要 |
PURPOSE:To package a semiconductor element whose electrodes are provided at higher pitches than conventional ones, by improving the adhesiveness of a sealing resin to a chip carrier (TAB tape), and by preventing the peeling of a board in the case of its mounting. CONSTITUTION:On a board 21 made of polyimide resin, a chip carrier 2 provided with leads 22 each of which has an inner lead 22a and outer lead 22b is provided. To this chip carrier 2, a semiconductor element 1 is bonded. A first molding resin 3a wherein the semiconductor element 1 and the inner lead part of the chip carrier 2 are buried completely is formed. A second molding resin 3b which covers both the top surface of the chip carrier 2 and the part of the first molding resin 3a which is present on the upper side than the chip carrier 2 is formed. On the outer leads 22b, solder bumps 5 are formed. |
