| 摘要 |
A technique for the attachment of leads to electronic devices which permits operation of the devices over a wide temperature range. The technique contemplates the use of core conductors having a thin coating of metal thereon whereby only a limited amount of coating material is available to form an alloy which bonds the core conductor to the device electrode, the electrode composition thus being effected only in the region adjacent the lead and the bond between the electrode and device being unaffected.
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