Encapsulated integrated circuit and method

摘要

An encapsulated integrated circuit having a lead frame comprising a plurality of spaced leads extending outwardly from an inner region. A semiconductor chip is secured to the leads in the inner region. First and second parts formed of an insulating material are disposed on opposite sides of the leads. An adhesive is utilized for binding the first and second parts together with the lead frame to form a unitary assembly which encloses the semiconductor body.