Baths for electrodeposition of copper - contg soluble prod prepd by reacting alkoxylated polyalkylene-imine with alkylating agent

摘要

Acidic aqs. bath for the electrodeposition of copper, esp, for prodn. of printed circuit panels, contains a prod. (A) prepd. by reacting (1) a polyalkyleneimine (B) with (2) an alkylene oxide (C) and then treating the reaction prod. (D) with (3) an alkylating agent. These reactions are defined by the following scheme -(R1-NH-R2-NH)-n (B) +m - R6 (C) right arrow -(R1- -R2-N)-n + p(alkylating agent)right arrow(R1- R2- )-npXG (where R1 is 1-6C alkylene; R2 is 1-6C alkylene; R3 is -CH2- -R6 R4 IS R3 OR H; 1-4C alkenyl, 1-4C alkynyl, -CH2- -CH2-N(R7)3X circled negative; R5 is 1-4C alkyl, aralkyl, 1-4C alkylenesulphonate, or R6 is H, methyl or hydroxymethyl; R7 is 1-4C alkyl; in is 1-2; X circled negative is chloride, bromide or methosulphate; and p is 1 or 2). Bath gives uniform copper deposits with a high degree of brightness and ductility over a wide range of bath concns. and current densities. The salts have a satisfactory solubility in the baths, and are compatible with the other components.