| 摘要 |
PURPOSE:To facilitate the mounting of an electronic part such as a diode or the like having a surface mounting structure projected with lead wires from both ends of a cylindrical package on a printed board by winding a conductor or the like on the lead wires and providing an electrode covered with solder. CONSTITUTION:An element 1 is interposed between studs 1, is inserted into a glass tube 4, grooves 15 are cut on the lead wires 2 of an electronic part such as a diode or the like projected with the wires from both ends, conductors 16 are wound on the grooves, are caulked fixedly, and are covered with a solder layer 7. Then, the wires 2 are cut in the predetermined length, the end is formed with an electrode 18 of tablet shape. In mounting,the part is fixed with an adhesive layer of a printed board 6, and the electrodes 18 are secured on the wiring layer 10 by solder reflowing. |
