| 摘要 |
PURPOSE:To prevent a burr of resin by a method wherein a radiating plate is corrected so that its back side sticks to the one surface of a metal mold of a molding device. CONSTITUTION:A semiconductor device component is set up on a lower metal mold 7 wherein a fitting member 1 of a heat radiating plate 3 is placed on the upper surface 7a, while a semiconductor element 5 is positioned in a cavity 8. Next, the lower metal mold 7 is lifted to hold the fitting member 1 and a lead 4 of the heat radiating plate 3 between the upper surfaces 7a, 7b of the lower metal mold 7 and lower surfaces 9a, 9b of an upper metal mold 9. Thus, a fixing member 2 which is bent to the fitting member 1 is corrected by the lower surface 9a of the upper metal mold 9, and its back surface 2b is placed in contact with the lower surface 9a. |
