发明名称 METHOD AND APPARATUS FOR THE APPLICATION OF LIQUID MATERIALS ONTO SUBSTRATES
摘要 <p>A method and apparatus for application of heat curable liquid (15) onto substrates is provided. The present invention allows high speed selective application of curable liquid (15) to a continuous succession of discrete substrates (74) disposed on a conveyor belt (18). Each substrate (74) is stabilized on the conveyor belt (18) via a stationary magnetic device (42), liquid applicator guns (30) are adjusted along a desired axis in relation to each substrate (74), heat curable liquid is applied, and each coated substrate is cured via heating device (54) in order to form a solid or foamed coating on at least a portion of each substrate. The present invention provides increased speed efficiency and adherence of the liquid cured onto the substrates.</p>
申请公布号 WO1996001155(A1) 申请公布日期 1996.01.18
申请号 US1995008492 申请日期 1995.07.05
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