| 摘要 |
PURPOSE: To provide a method for fixing a semiconductor substrate on which at least a semiconductor device is provided, without wasting time and requiring no complicated means when the semiconductor substrate/to be separated from a semiconductor wafer having a number of semiconductor substrates of the same type, is treated. CONSTITUTION: This semiconductor substrate 1 comprises semiconductor wafers 11 having a number of the same or similar parts, and the first contact layer 6 and a metal powder layer 10 are provided on the backside of the wafers 11. Then, the metal powder layer is sintered, the semiconductor wafers 11 are adhered to a sheet of adhesive foil, the semiconductor wafers 11 are saw-cut along the dividing line surrounding the divided semiconductor substrate, the adhered foil is separated from the divided semiconductor, and fixed to a substrate 7. |
