| 摘要 |
A method and apparatus for tinning and soldering metal parts of electronic components and assemblies, and removing excess solder therefrom. The metal parts of the electronic components and assemblies are heated to a temperature near that of molten solder. A holding fixture, adapted to hold the heated components, slidably connects to an acceleration means which dips the metal parts of the components into the molten solder. Then acceleration energy is applied to the acceleration means, causing it to rapidly remove the components from the molten solder. Rapidly removing the components from the molten solder leaves excess solder behind, whereby all metal parts of the components are thoroughly tinned and soldered together without leaving unwanted solder bridges therebetween. A vibration means may also be used to prevent solder voids and promote solder wetting in densely packed leads and rails being tinned.
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