| 摘要 |
PURPOSE: To provide a device and a method for piling up, aligning, and clamping semiconductor wafers before polishing the edge of the wafers. CONSTITUTION: A pusher (pushing body) 40 moves a wafer 21 from a cassette 35 into an integrator 11. Then, a load shuttle 41 eliminates a wafer cassette and moves a spacer, cassette 36 to a proper location. The pusher 40 moves a spacer 22 from the cassette 36 into the integrator 11. Then, the pusher 40 and a plate 12 move a wafer spacer laminate 43 to a clamp position with aligning towers 15 and 16 at the back. The wafer 21 and the spacer 22 are clamped together by a shaft clamp so that they can be loaded into a polishing machine, thus treating a number of wafers simultaneously and hence saving time and expenses.
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