发明名称 Aqueous degreasing composition and process
摘要 An aqueous degreasing composition which is free of silicates, chelates and inorganic phosphates and a method for degreasing metal substrates which are sensitive to these types of compositions. The composition of the present invention includes: an alkali builder constituent which contains no phosphates, silicates or chelates; and a nonionic surfactant effective amounts for removing oils from a substrate, a hydrotrope constituent in effective amounts for solubilizing the soils removed and for solubilizing the nonionic surfactant and an amphoteric surfactant in effective amounts for removing long chain soils from substrates and a salt of polymerized alkyl naphthalene sulfonic acid as a dispersant with the remainder being water. In the method of the present invention, the above composition is diluted from about 1% to about 100% by volume with water to provide a desoiling solution. The solution is then heated to a temperature from about 100 DEG F. to about 200 DEG F. A part requiring removal of soils is immersed into the solution and thereafter some type of agitation is used with the part and solution for an effective amount of time to remove soils from the part.
申请公布号 US5372741(A) 申请公布日期 1994.12.13
申请号 US19910799565 申请日期 1991.11.27
申请人 ETHONE-OMI, INC. 发明人 TOMASZEWSKI, LILLIE C.
分类号 C11D1/34;C11D1/72;C11D1/88;C11D1/94;C11D3/37;C23G1/14;(IPC1-7):C11D1/10;C11D1/12;C11D7/36;C23G5/00 主分类号 C11D1/34
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