| 摘要 |
A system for wet application of a dry film, such as a photoresist, to a generally planar panel having upper and lower surfaces, such as a printed circuit board, is provided. The apparatus comprises rotatable upper and lower wetting rollers each having an absorbent material such as neoprene on the surface thereof, and a mechanism for holding the upper wetting roller in forcible contact with the lower wetting roller so that rotation of the lower wetting roller is translated into rotation of the upper wetting roller. The lower wetting roller is positioned at least partially within a container providing a supply of wetting agent, such as water, such that the wetting agent is in contact with the absorbent material on the surface of the lower wetting roller. Wetting agent absorbed by the absorbent material on the lower wetting roller is transferred to the absorbent material on the upper wetting roller when the upper and lower wetting rollers are rotated, and wetting agent absorbed by the absorbent material on the upper and lower rollers, respectively, is transferred to the upper and lower surfaces of the panel to wet the surfaces when the panel is drawn through the rollers. A pair of upper and lower film supply rolls are provided for applying layers of film, respectively, on the upper and lower wetted surfaces of the panel, and a pair of upper and lower cure rollers are provided for curing the upper and lower surfaces of the panel having film applied thereon.
|
