| 摘要 |
<p>PURPOSE:To perform kerf checking smoothly by recognizing the position, shape and size of a material to be machined based on the obtained information. CONSTITUTION:The shape of a material to be machined, i.e., a semiconductor wafer W, on a wafer-standby region 4 is recognized with a shape recognizing means 7. The semiconductor wafer W is positioned directly beneath an alignment means 8, which also serves the role of kerf check, based on the obtained information. The alignment is performed, and general angle correction is performed. Thereafter, the precise alignment is performed. A blade 9 is sent into the direction of the Y axis based on the obtained information, and the cutting and sending are performed in the direction of the X axis. Thus, the wafer W is cut. Then, the Y coordinate of the kerf to be checked is confirmed. The X coordinates of both end parts, whose Y coordinates are equal, are recognized. The Kerf is automatically positioned directly beneath the alignment means 8. Then, the kerf check is performed. Therefore, the alignment means 8 is not set at a position, which is separated from the semiconductor wafer W, and the kerf check can be performed securely and efficiently.</p> |
