| 摘要 |
PROBLEM TO BE SOLVED: To provide an alignment mark which can be manufactured concurrent with each circuit element of a semiconductor element, and is clear and free from the possibility of collapse and exfoliation. SOLUTION: This aliginment mark is used for the position alignment of a semiconductor substrate 3, which is used in lithography performed as a manufacturing process of a semiconductor element and consists of a gutter-type pattern 11X having almost the same width as that of a circuit element 1X formed on the semiconductor substrate 3 surface. Since the width of the gutter- type pattern 11X is nearly equal to that of the circuit element 1X, a steady gutter-type pattern 1X which is not eliminated by more than a reguired amount by a process such as etch back can be formed on the semiconductor substrate 3 surface, when the pattern is formed concurrent to the circuit element 1. |
