| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin substrate, having high radiating characteristic by a method, wherein a thermosetting resin is filled up with an inorganic filler in high concentration for giving radiating property within a circuit substrate 2 which is made of a mixture of a synthetic resin and the inorganic filler, especially within the radiating resin substrate for packaging a power element and its manufacturing method. SOLUTION: A cover film 2 is stuck on both sides of a compressible sheet 1 and then an aperture part in a specific size passing through this sheet 1, and the cover film 2 in the thickness direction is made to be filled up with a paste containing a thermosetting resin and an inorganic filler, so that the both sides of the paste and the sheet 1 are pressurized through the intermediary of a mold release film to be heat-treated. Next, a part of the resin component in absorbed into the compressible sheet 1, an insulating resin paste 4 is set, and the mold release film is removed for stamping out an insulating resin paste set body 41 in a specific size to be formed into a substrate 10. Through these procedures, a radiating resin substrate 10 having extremely high thermal conductivity can be realized. |
